Basis for double-sided, plated-through PCBs

Rigid base materials are copper-laminated epoxy resin boards which are equipped with fibreglass reinforcement. They are the starting material for the manufacturing
of mostly double-sided, plated-through PCBs.

The laminate thickness is specified including the copper for rigid base material.
This laminate type is normally used for double-sided PCBs and has a printed

The following laminate thicknesses are used for double-sided PCBs and 4-layer
multilayers: 0.77 mm, 0.90 mm, 1.00 mm, 1.10 mm and 1.20 mm.

They are sold under the name NP-140 TL, normally without a printed logo. As for rigids, the thickness information includes the copper.

The close thickness tolerances are a TECHNOLAM speciality. According to IPC-4101-C,
you can source 0.77 mm, 0.90 mm, 1.00 mm, 1.10 mm, 1.20 mm and 1.55 mm
laminates from us in thickness tolerance class M without a surcharge. All further strengths can be obtained in tolerance class L.


The following rigid types are available from TECHNOLAM


  • Standard base material - FR4-86 UV-Blocker, FR4-86 PY (CTI 600 V)
  • Halogen-free base material - NPG-R, NPG-170R
  • Phenolic cured, filled base material - NP-155FR, NP-175FR


Your components for multilayer manufacturing

Multilayer thin laminates exist in the thicknesses 0.05 mm to 0.80 mm. The thickness
specification refers to the base material without copper lamination. Thin laminates are supplied without logo printing and the abbreviation TL for thin laminates is used in their type designation.

Five thicknesses (0.77 mm, 0.90 mm, 1.00 mm, 1.10 mm and 1.20 mm) are used both for multilayers and double-sided boards. For these laminates, the thickness
specification is based on the rigid material and includes the copper. They are offered without logo printing and in thickness tolerance class M according to IPC-4101-C.

For some core thicknesses, several glass fabric design variants are available from NAN YA. Despite having identical nominal dimensions, they have different thickness
names in order to describe the product concerned clearly. For correspondence
with you, TECHNOLAM uses the specifications in the material name. The different
base material layer structures can be found in the data sheet under “Layer

All thin laminates are normally supplied in tolerance class C according to IPC-4101-C.

The following thin laminates are available from TECHNOLAM


  • Standard base material - NP-140TL
  • Halogen-free base material - NPG-TL, NPG-170TL
  • Phenolic cured, filled base material - NP-155FTL, NP-175FTL
  • Available matching prepregs - NP-140B, NPG-B, NPG-170B, NP-155FB, NP-175FB


In order to achieve the desired layer space and the conductor path embedding, both
different glass fabric types and different epoxy contents are available from us.

All TECHNOLAM / NAN YA thin laminates and prepregs are anti-CAF base materials due to the glass fabric, the purity of the epoxies used and the controlled manufacturing process.


Your base materials for simple PCBs

Composite materials are similar to the rigid base materials. However, they do not consist of one continuous glass fabric carrier. As a cheap base material, CEM-1 has cores consisting of epoxy resin impregnated paper, each with a glass fabric top layer. CEM-3 has randomly orientated glass fibre cores with epoxy resin impregnation
and also each with a glass fabric top layer.

Laminat CEM-1-97

The laminate CEM-1-97 is available in accordance with the IPC-4101-C specifications
sheet no. 10. Due to its cellulose paper core, it is not suitable for through-hole plating processes. The base material is normally supplied in the tolerance class L (IPC-4101 B), if desired we can offer the thickness 1.52 mm ± 0.100 mm for single-sided material, for double-sided material the thickness 1.55 mm ± 0.100 mm. CEM-1-97 has a CTI of 600 V.

Laminat CEM-3-92

Our CEM-3 with the name CEM-3-92 is equivalent to IPC-4101-C specification sheet no. 12. The major advantage of this material is its low drill abrasion compared to
standard FR4-base-materials. The product is suitable for interlayer connection.